Leveraging Vapor Phase Reflow

When critical electronics face unacceptable failure rates, innovative solutions are essential. Microboard executed a critical Department of Defense program solving complex yield issues on a dense 28-layer PCBA. The result? A dramatic transformation in performance, reliability, and cost efficiency using Vapor Phase Reflow technology. 

The new process enabled Microboard to:

• Increase yields at the circuit card level.
• Reduce system-level fallout during Environmental Stress Screening (ESS).
• Deliver a 96% first-pass yield, drastically lowering rework and scrap rates.

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